Grain Refinement of Tough Pitch Copper by Electromagnetic Vibrations during Solidification
نویسندگان
چکیده
منابع مشابه
Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire
Tough pitch copper wire (99.97% Cu) is generally characterized by the spiral elongation number. The principle of the test is based on the influence of impurities on the recrystallization kinetics. Alternative non-metallographic techniques to characterize the recrystallization kinetics have been investigated in this study, such as differential scanning calorimetry (D.S.C.) and residual electrica...
متن کاملMagnificent Grain Refinement of Al-Mg2Si Composite by Hot Rolling
The effect of chemical composition and the hot rolling operations on the microstructure and mechanical properties of in situ aluminum matrix composite with Mg2Si phase as the reinforcement was studied. It was revealed that the modification by phosphorous results in the rounder (more spherical) primary and secondary (eutectic) magnesium silicide intermetallics. During hot rolling, the primary pa...
متن کاملPhase-field modelling of rapid solidification in alloy systems: Spontaneous grain refinement effects
Phase-field modelling of rapid alloy solidification, in which the rejection of latent heat from the growing solid cannot be ignored, has lagged significantly behind the modelling of conventional casting practises which can be approximated as isothermal. This is in large part due to the fact that if realistic materials properties are adopted the ratio of the thermal to solute diffusivity (the Le...
متن کاملElectromagnetic energy harvesting from vibrations induced by Kármán vortex street
A new electromagnetic energy harvester for harnessing energy from vibration induced by Kármán vortex street is proposed. It converts flow energy into electrical energy by fluid flow, vortex shedding from a bluff body and electromagnetic induction. An analytical design method for the energy harvester is developed. A prototype of the energy harvester is fabricated and tested. The prototype has a ...
متن کاملMicrostructure evolution and abnormal grain growth during copper wafer bonding
Evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing were studied by means of transmission electron microscopy, electron diffraction and X-ray diffraction. The bonded Cu grain structure reaches steady state after post-bonding anneal. An abnormal (220) grain growth was observed during the initial bonding process. Upon annealing, the ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2006
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.47.1793